抄録
This paper involves the development of three-dimensional microstructure formation and rapid growth copper electroforming technology in LIGA process. The important contributions involve using multiple power supplies in parallel and air-pressure assistance for the electroforming system to enhance the electroforming rate. The proposed method enhances the allowable applied current density in electroforming. Rapid growth rate is produced in the electroforming process and good deposition material properties are maintained. high cathode efficiency and short plating time were also achieved. The experimental graphs demonstrated these results. The LIGA process involved here to form plastic micromolds for three-dimensional electroforming is also introduced. Graphite film is applied as the x-ray mask membrane, producing successful PMMA exposure at 1mm thick. This proposed electroforming technology has practical applications compared with previous studies on current waveform, electrical potential, agitation method, and electrolyte composition.
