Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer
公開日: 2020/08/25 |
2007.4
9D435
Etsuji OHMURA, Masayoshi KUMAGAI, Makoto NAKANO, Koji KUNO, Kenshi FUKUMITASU, and Hideki MORITA
2
1001 Development of high performance polishing slurry for glass
公開日: 2017/06/19 |
2015.8
1001
Okiharu Kirino, SeungBok Lee, Yuji Kawahata, Yu Zhang, Yasuhiro Tani
3
2508 Press Molding of Si-HDPE Hybrid Lens Substrate for Infrared Optical Applications
公開日: 2017/06/19 |
2015.8
2508
Ahmad Rosli ABDUL MANAF, Jiwang YAN
4
A010 Fundamental Characteristics of Spatter in Micro-drilling of Metal Sheet by Pulsed Nd:YAG Laser
公開日: 2017/06/19 |
2013.7
A010
Kento SHIRASAYA, Yasuhiro OKAMOTO, Akira OKADA
5
D24 Investigation of Sustainable and Reliable Manufacturing System Based on the Environmental Impact(Life cycle engineering and environmentally conscious manufacturing)