Partial Growth of Crack in Laser Scribing of Glass

抄録

The crack depth of laser scribing is limited because the inner compressive stress region under the cooling area prevents median crack growth. In this study, the glass was masked partially on the scribing line so as not to generate an inner compressive stress region and we found that the median crack depth of laser scribing was deeper in the experiment. Thermal stress analysis of this phenomenon was conducted by using a three dimensional FEM. As a result, the stress distribution and the phenomenon in which the median crack grew deeper corresponded qualitatively well.