Proposal of Laser Cleaving Process Utilizing Temperature Gradient in Thickness Direction

抄録

In this paper, a novel method of laser cleaving for the brittle substrate cutting is proposed, in which the crack is propagated by temperature gradient in thickness direction caused by laser with the wavelength transparent for substrate materials. The laser energy is absorbed at the back surface and generates the temperature gradient and the local bending moment that effectively propagates the crack from the initial defect on the incident surface. Irradiating conditions for glass substrates to achieve precise cutting are investigated by simple cleaving experiments. Then, it is confirmed that high quality cutting can be easily obtained by the proposed method.