主催: The Japan Society of Mechanical Engineers
会議名: 第9回 21世紀における先端生産工学・技術に関する国際会議 (LEM21)
開催日: 2017/11/13 - 2017/11/17
Recently, high heat density has become a problem in electronic devices. Therefore, high heat-transfer efficiency is required in copper heat exchangers. Previous studies have reported that a copper oxide layer enhances wettability. In this study, we focus on a copper oxide layer produced under warm conditions (from 200 to 300°C), which are suitable oxidation conditions for improving wettability.
Experimental results showed that the hydrophilicity was enhanced by the warm copper oxide layer. The surface roughness was approximately constant. The results from SEM observations showed that the warm copper oxide layer consisted of stacks and combinations of nanoscopic warm oxidation particles.
