J031033 はんだBGA ボールを用いた微小接合部クリープ強度評価([J03103]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

抄録

For reliable design of the high-density electronics parts, it is very important to understand a creep strength of solders-Cu joint interface. For this purposes, in this study, a new method to prepare a miniature specimen having BGA solder balls and thin Cu wire were established. And also, creep strength were evaluated by using a newly developed creep testing machine for miniature solder specimen.