年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: S101024
会議情報
S101024 東日本大震災における半導体製造工場の被害状況 : 地震被害の概要,復旧状況と提言-その2
藤田 聡皆川 佳祐
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会議録・要旨集 フリー

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抄録
The devastating earthquake of Mw9.0 hit the Tohoku district, north-east part of Japan on March 11, 2011. About 16,000 people died and 3,000 people were missing by the strong motion and tsunami, and the economic damage was estimated about 16.9 trillion yen except for the influence by the nuclear accident of Fukushima Danchi Nuclear Power Plant. The industrial facilities, power plants, or research facilities were damaged in this earthquake, and various kinds of mechanical equipment set in these facilities were also damaged. The Japan Society of Mechanical Engineers (JSME) have set up the investigation committee and investigated the seismic damage of mechanical equipment of these industrial facilities for the purpose to understand the situation and cause of the damages in such facilities and contribute to improvement of preparedness for the forthcoming earthquake. This paper provides a summary of the typical damages of a semiconductor manufacturing factory. This facility had been promoting various measures such as not only seismic reinforcement of the facilities but also one of the earliest introduction of the Early Earthquake Warning system. Thereby, although the facility was hit by unexpected massive earthquake, the structural damage was considered to be kept to a minimum.
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© 2012 一般社団法人 日本機械学会
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