抄録
Characteristic of nanowire is gradually attracting many researchers with potential applications of nano devices, nano sensors, solar sells and so on. This paper describes fabrication and evaluation of Cu nanowire surface fastener grown in porous aluminum. To fabricate nanowire surface fastener, at first BGA electrode patterns are fabricated on the resist on Si wafer by photolithography. Next, Cr and Au films were evaporated on the patterned side of Si wafer as a conductive working electrode. After that, the wafer was lifted off using acetone. Nanowire surface fastener was formed via electrical deposition in copper sulfate aqueous solution. After etching in 3 M NaOH aqueous solution to remove porous aluminum, we obtained nanowire surface fastener on Si wafer perpendicular to its surface. High density Cu nanowires with average diameter of 80 nm were observed by scanning electron microscope. In order to understand the performances of Cu nanowire surface fastener, electrical and mechanical properties of them were studied in details.
