抄録
Flow soldering process with a simple model has been studied using CFD. Through-hole printed circuit board with surface mounted components is the object of this study. In this process, surface mounted components are soldered first and covered with a mask; then through-hole components without a mask is soldered by dipping the board into a solder bath. We to investigate the solder flow in narrow aisle between the masks. The effect of computational domain is clarified. Flow in solder causes surface deformation and increases surface rise rate.
