抄録
A novel moving mask exposure apparatus for 2.5 dimensional patterning of thick photo resist has been developed. In general mask aligner, the UV light intensity that passes through photo mask shows exactly same shape of mask pattern. By in plane moving PZT-stage which carrying photoresist coated substrate, the UV intensity distribution via photo mask has been modified from simple binary pattern to Gaussian like pattern. The stage movement can be controlled by applying signal to stage that enables to generate arbitrary UV intensity distribution. Using the exposure apparatus and backside exposure technique we created photoresist molds for micro well array that have smoothly tilted sidewall. These photo resist molds were replicated by Poly-(dimethylpolysiloxane) to make final product with good shape transferability.
