The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2014
Session ID : J2220205
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J2220205 Development of an Infrared Thermal Imaging Device using Photo-patternable Temperature Sensitive Paint
Takashiro TSUKAMOTOMing WANGShuji TANAKA
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Abstract
This paper reports a novel thermal imaging device using a photo-patternable temperature sensitive paint (PTSP). The PTSP, which has the temperature dependence of luminescence, is used as both structural and temperature sensing materials. The self-suspended PTSP structures are heated up by the radiation from an observation object, and the temperature change is converted to the intensity of luminescence, which can be measured by a CCD camera. A transfer method was employed to prevent the self-suspended structures from sticking to the device substrate. The thermal image of a black body object heated at 700℃ was successfully obtained. The proposed thermal imaging device is applicable to low-cost thermal imaging applications such as home-security and fire detection/extinction systems.
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© 2014 The Japan Society of Mechanical Engineers
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