抄録
In this paper, the influence of vacuum annealing on the mechanical properties of gold (Au) bonding wires is described. Au bonding wires with the diameter of 25μm are subjected to quasi-static uniaxial tensile tests at laboratory air. The bonding wire specimens are prepared by the attachment of a wire to a silicon (Si) frame fabricated by deep reactive ion etching (DRIE). The Young's modulus and 0.2% offset yield strangth are 113GPa and 310MPa on average. By annealing at 100〜300℃ for 10min in vacuum, the Young's modulus value gradually decreases with increasing annealing temperature, whereas the yield strangth value drastically drops in the annealed wires at over 200℃. The annealing effect is discussed in the light of a change in the number of recrystallized grains in the wires.
