J2210203 Study of thermal characterization for thin-layer Sn-Ag solder joint fabricated by self-propagating exothermic reactive bonding technique

Abstract

Self-propagating exothermic reaction of Al/Ni multilayer film has been attracting us to utilize for solder joint process due to the enormous heat generation. In this paper, characterization of thermal resistance of the joint by self-propagating exothermic reaction bonding technique is discussed. Through the investigation of thermal resstance of the joint analyzed by response function method and thermal effusivity measured by thermoreflectance method, we found that thermal resistance of the joint is affected not only existence of cracks and voids but also thermal effusivity change of the reacted NiAl layer which depends on the pressure load during exothermic reaction.