抄録
A novel micro electro mechanical system (MEMS) device for flatness measurement with a five point method has been proposed. This device integrates five cantilever displacement sensors, three are for straightness measurement and other two are for connecting results of straightness measurements, with a narrow pitch on a silicon chip. The authors designed a compact device of which size is 20 mm × 20 mm. Five triangular cantilever with altitude 6.5 mm long, base 2.5 mm long, and 0.25 mm thickness was placed oppositely and alternately on the device for downsizing the device. Near the end of each cantilever, a square frustum probe 250 μm high which was fabricated by anisotropic wet etching was placed. Near the base of cantilevers, four piezo resistance gauges were formed; two are active gauges for measuring stress arise from a displacement of the probe and the others are dummy gauges for temperature compensation. A fabrication process of this device was designed and result of a trial production was reported.
