グリーンデバイス用結晶基板の加工プロセス技術の研究

（革新的研磨パッドの耐久性評価）

抄録

Silicon carbide is one of the wide-gap semiconductor such as Sapphire and Gallium Nitride, which are being attracted attention as a green device. However, these mentioned materials are hard-to-processes materials. In the Polishing process is required tremendous time consuming to achieve high precision surface, which is regarded hindrance factors to the cost reduction. In order to get the break through, we have developed a dilatancy pad ^®. In this paper, polishing reliability and sustainability evaluation is proposed, and succeeded the constant quality even after 100 hours while maintain the processing conditions.