単結晶シリコン並列引張試験における集積化せん断型ひずみゲージによる荷重検出

抄録

A tensile-mode parallel fatigue testing device with integrated shear strain gauge has been developed for reliability assessment of single crystal silicon (SCS) microstructures. We must shorten the testing time need to be shortento realize ultra-high cycle fatigue testing for ensuring the long time reliability of MEMS device. Our approach is parallel testing and high stiffness strain gauge to increase loading frequency. In this report, we introduce a design of shear strain gauge, which has improved stiffness and sensitivity. The testing device has five SCS specimens of 120 μm long, 4 μm wide and 2 μm thick, integrated with the shear strain gauge. We performed parallel tensile testing with the device fabricated from p-type silicon-on-insulator wafer and confirmed output from the strain gauges. Stress calibration with finite element analysis, theoretical calculation and digital image correlation was performed and the order of results correspond with each other.