デジタル画像相関法を用いたSiC繊維SiC複合材料の微視的損傷評価

抄録

This study examined the evaluation of microcrack progression in transverse layers of an orthogonal 3-D woven SiC fiber-reinforced SiC matrix (SiC/SiC) composite under tensile loading using digital image correlation (DIC) method. Observation area was approximately 1 mm field of view, therefore an optical microscope was used for taking images for DIC. The microcracks in transverse layer were successfully observed as larger displacement gradient because of crack openings. The onset stress of crack initiation was determined comparing the crack opening displacement (COD) with setting an appropriate threshold value. However, there are some difference in crack opening stress compared with visual crack observations because of the decline of precision in DIC results under loading. The experimental results were directly compared with the numerical analysis.