半導体ひずみセンサーを用いた切削状態モニタリング技術の開発

抄録

Modern machine tools with sofisticated CNC controller are operated by the NC program and it improves the productivity in unmanned factory. However, the movement of the machine tool was previously determined by program, so the cutting process itself is not be adapted based on physical phenomena of cuttong tool and work materials. In this study, the newly developed semiconductor strain sensor was adopted to achive the simple and reliable cutting tool monitoring. This strain sensor was mass-produced by CMOS technology and all functional parts such as strain sensing devices, bridge circuit, A/D convertor and controllers were integrated in one chip. Experiments showed that it is possible to detect the strain due to the static load acting on the tool holder. Furthermore, it was possible to detect that the cutting phenomena changed from stable state to chatter vibration state during cutting process. It is shown that the state monitoring during the cutting process is possible with a semiconductor strain sensor.