Cu₃Snバルク試料のマイクロインデンテーションにおける非弾性変形とその温度依存性

抄録

In next-generation power modules, the mounting of the power semiconductor chip using GaN and SiC, which can work in high-temperature environments over 200°C, is demanded. For the mounting, the lead-free solder with a melting point of around 200°C and high melting point solders containing harmful lead cannot be used. So in late years, the sinter bonding using Cu₃Sn, which is a Cu/Sn intermetallic compound, attracts attention. For the practical use of the bonding, it is necessary to clarify the strength reliability of the Cu₃Sn. Therefore, in this study, to evaluate the deformation properties of the Cu₃Sn, a micro-indentation tests are carried out at temperature from room temperature to 200°C for a bulk sample of Cu₃Sn made using the arc melting method. According to these results, Young's modulus and tensile strength of Cu₃Sn in each temperature are estimated. And it is found that the amount of inelastic deformation increases with a rise in temperature.