フロントローディング設計の為の1DCAEでのパワー半導体の熱設計

（VHDL-AMSによるパワー素子と周辺部品モデルの開発）

抄録

Recent years, MBD method is used for front-loading of development flow. Especially in the development that requires multi-domain including electronic circuits, the part designed by 3DCAE other than the circuit will be converted into 1DCAE and verified. In 3D verification, there are problems of time and computational resources, but the behavior of the entire system can be verified by raising the level of abstraction of phenomena other than circuits. Conventionally, MBD was mainly verified by mechanical ones, but the importance of verification including electronic parts increased due to the recent change from engine to motor. If the maximum rating value is exceeded for electronic parts, failure and reliability will drop. New consideration is required for electronic parts to satisfy their ratings and reduce their reliability. High-accuracy models of power devices and peripheral parts are necessary to realize this verification. What functions required for models of peripheral components, using a buck switch mode power supply as an example. In the verification of a buck switch mode power supply (SMPS), the inductance model required superposed current characteristics and temperature characteristics. We show that the reliability was secured by the method of creating this inductance model and the SMPS operation verification. -