MEMS構造体を利用した薄膜内部応力の測定

抄録

In this research, we aimed to establish a new measurement method of internal stress using MEMS structures. The measurement sample was a thin film metallic glass, which has higher strength and lower Young's modulus compared to Poly-Si. The thin film metallic glass samples were formed by sputtering, and their shape was a fixed beam at both ends. In order to avoid the deterioration of the cross-sectional shape of the structure caused by the film thickening, we used a reverse lift-off method. It is the method that forms film on a desired pattern and remove the others to obtain the flat and uniform thickness structure. We devised a process to fabricate devices to measure the internal stress of a thin film metallic glass samples and confirmed the feasibility of fabricating the devices by carrying out the process. We also tried to measure the displacement of the devices that were successfully fabricated devices.