ランダム加振を受ける宇宙機搭載電子部品はんだ接続部の疲労設計のための共振倍率実験式

抄録

In considering the fatigue life of solder joints of onboard electronic components subjected to random excitation, which is an important issue in the reliability design of spacecraft, we conducted an experimental study on the resonance factor, which is the main factor controlling the life. An experimental system was constructed to measure the resonance factor of small components soldered to a circuit board under a wide range of excitation conditions from 20 to 2000 Hz. By organizing the results of measurements under various conditions, we were able to derive an equation that predicts the resonance factor as a function of the resonance frequency of the electronic component and the excitation intensity of the random excitation load.