主催: 一般社団法人 日本機械学会
会議名: 2024年度 年次大会
開催日: 2024/09/08 - 2024/09/11
This paper discusses inductively coupled plasma discharge which is widely used in semiconductor fabrication processes, from view point of numerical evaluation. Three-dimensional asymmetric simulation is performed using COMSOL MultiphysicsⓇ. Mixture gas of Ar/CH4 is introduced as a reaction gas. Two different modelling methods for coil are investigated. It is shown that modelling the coil as a boundary type is an optimized method, comparing to model the coil as a domain type.