抄録
Using a fatigue testing method by which fatigue cracks can be initiated and propagated in a film adhered to cover a circular through-hole in a base plate subjected to cyclic loads, annealed rolled pure copper films of 100μm thickness were fatigued. In order to discuss about the correlation between fatigue crack propagation and the change of electric properties, the electric resistance of the copper film was measured by four-point probe method. As a result, the electronic resistance was changed remarkably at the slip initiation and the crack initiation.
