抄録
Using model specimens where pure copper films were bonded to the surface of S45C steel base plates with epoxy resin, the initial tensile residual stress on the copper film was changed into a compressive residual stress by peening with fine ceramics particles accelerated by waterjet. In the fatigue testing results, the specimen with a thicker bonding layer had a larger fatigue life than that with a thinner one, due to the larger crack propagation life through the bonding layer caused after the fracture of the film and the base plate. In addition, the relationship between the fatigue crack propagation rate, da/dN, and the crack opening displacement range at 100μm behind the crack tip, ⊿φ_<100>, on the epoxybonded film was almost the same as that for the steel base plate, irrespective of the bonding layer thickness.
