抄録
Difference of material properties induces a stress singularity at the corner in the joint of resin, IC and substrate due to the variation of environmental temparature. It is known that the main cause of the failure of CSP (Chip Size Package) is a three-dimensional stress singularity around a vertex of resin and IC-substrate, because delamination usually occurs at the vertex of three-dimensional joints. In the present study, we use a three-dimensional model, which is consisted of a resin-sealed sheet sandwiched by Si plate, for evaluating the strength of interface. We analyze the stress intensity factor for the three-dimensional singularity field at the vertex of interface.
