抄録
The bond joints are used in the various environments, and the indispensability for the industrial society. This is done under the high temperature, the normal temperature and the low temperature, the behavior of the stress in these conditions changes. In the case of the thermal experimental analysis, this has to consider the temperature of the environment. The authors made the new architect system for the purpose of the thermal experimental analysi. This is keeping at the constant temperature that is indicated, the specimen is doing at the same temperature. This is the experiments that is reproduced the same environment at the same temperature. This system is able to carried out the various temperature, the good result from this new system was able to get.
