Static strength tests and dynamic fatigue tests were conducted on a polycrystalline silicon material, which is one of the most common materials to compose micro electromechanical systems. Scatter of static strength was explained in terms of the distributed length of equivalent cracks, which in tern was analyzed with the fatigue crack propagation law to estimate the distribution of fatigue lifetime. By fitting the experimental data to the theory, the cumulative probability of fracture was plotted in a three dimensional manner as a function of both the amount of applied stress and the number of fatigue cycles. This plot quantitatively characterizes the reliability of the polycrystalline silicon material examined in this study.