抄録
Slurry flow in CMP (Chemical Mechanical Polishing) process on the polishing pad was studied. Numerical simulations were carried out for smooth pad and circularly grooved pad. One role of grooves is to replace old slurry to new slurry quickly by transporting the slurry. Another is to carry particles away to prevent deep scratches. Studying the slurry flow and transport in the grooves in details, the role of circular grooves is clarified.
