抄録
Novel self-assembly process using electrostatic adhesion energy induced by contact electrification phenomenon is proposed for the first time. The contact electrification, which is observed when two different metals, such as platinum (Pt)-Silver (Ag) are contacted, was utilized to align a face of a component on a substrate. Two types of 1mm square silicon components with thickness of 0.5mm coated with Pt or Ag and Pt substrate were prepared. Adhesion energies for two different metal pairs (Pt-Ag and Pt-Pt) were measured by measuring the vibration energy to separate the components from the vibrating substrate. The experimental results indicated the adhesion energy between Pt-Pt was 0.57nJ, and Pt-Ag was 1.4nJ on an average. Secondly, the face alignment experiment was carried out by vibrating the substrate on which 20 components with thickness of 0.2mm were placed. The front and back face of the components were coated with Pt and Ag, respectively and they were split into half of Pt face up and the other half of Ag face up. Finally, we could get 83% components were aligned as Pt face up.
