抄録
In semiconductor manufacturing processes, a new pneumatic non-contact handling device is developed. This device named Vortex Cup makes use of a vacuum at a central area of swirling flow in order to hold the wafer against the device and to prevent significant wafer damage and foreign material contamination. Vortex Cup provides lower-cost, higher-performance than other pneumatic type devices. Experiments on Vortex Cup have turned out that the vacuum depends on the gap and supply flow rate, and swirl axis is inclined inside a cup. In order to improve performance of Vortex Cup, we focused on nozzle inlet height and aspect ratio of a cup. In this report, pressure distribution of various cup is measured. Furthermore, fluid motion in a cup is revealed by ink injection method.
