年次大会講演論文集
Online ISSN : 2433-1325
セッションID: J0403-1-3
会議情報
J0403-1-3 熱膨張性マイクロカプセル混入接着剤に生じる残留応力の有限要素解析([J0403-1]締結・接合部の力学と評価(1):接着接合)
浦谷 佳明佐藤 千明
著者情報
会議録・要旨集 フリー

詳細
抄録
Adhesive joints have a lot of merits. For instance, it is easy to bond different types of materials and realize light weight structures. However, the bonded adherend has been difficult to be recycled. Currently, dismantlable adhesives that can be separated by a trigger have been developed. In this case, the adherends are recyclable. The adhesives include thermally expansive microcapsules (TEM). However, some properties of TEM are still unknown. In this research, the effect of the size and position of TEM in adhesives is studied using FEA.
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