抄録
For the stabilization of insulation performance in resin-molded insulators, strong adhesion between the resin and ceramic is required. In this paper, a new technique for the control of the interfacial strength in resin-molded structures has been proposed. The adhesive strength of the internal interface in a resin-molded structure was estimated as the interfacial fracture energy by using the molecular dynamics method. The interfacial fracture energy was qualitatively in agreement with the adhesive strength index obtained by a shear experiment. Based on the simulation results, the control of the interfacial strength was performed, and it became clear from the result that the interfacial strength between resin and ceramic can be improved up to the strength level of the glaze adhesion.
