抄録
A speckle photography (one beam method) that does not need the special vibration isolation is possible to measure the displacement irrespective of objective magnitude. In this study, the displacements near the crack tip of the CNS (compact normal and shear) specimens subjected to the mixed-mode loading were measured by the speckle photography. From the nodal displacement, the stress-strain analysis was conducted by using the latter algorithm of FEM. Finally, the stress-strain relationship was discussed in terms of comparison between the speckle photography and finite-element analysis. Moreover, the intelligent hybrid method proposed by Nishioka et al. was applied to the stress analysis.
