Proceedings of JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment : IIP/ISPS joint MIPE
Online ISSN : 2424-3132
2015
Session ID : MoP-23
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MoP-23 FABRICATION OF EMBEDDED GOLD MICRO ELECTRODE WITH PI IN PDMS SUBSTRATE USING MODIFIED DRY PEEL-OFF PROCESS
Ryohei UenoIkjoon ByunYuki MizunoBeomjoon Kim
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Abstract
The present paper describes a modified dry peel-off process to fabricate stable gold micro electrode with polyimide (PI) embedded in a polydimethlysiloxane (PDMS) substrate. three kinds of self-assembled monolayer (SAM) were employed to control adhesion strength and to transfer gold micro electrodes from silicon substrate in driect.
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© 2015 The Japan Society of Mechanical Engineers
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