抄録
Electronic devices have reduced size, complex structure and contain various materials. Therefore, evaluation of the mechanical properties of electronic devices faces mounting difficulties. Recently, some mechanical properties such as elastic, plastic and creep deformations are predicted by indentation method. It is suitable method for small electronic devices. In this study, mechanical properties of solder which are commonly used for electric devices, are measured by indentation method and verified the accuracy of measurement compaiing with tensile test. As the results, the estimated elastic-plastic properties are in good agreement with tensile test results. Furthermore, the estimated creep properties are in good agreement with tensile creep test results.
