The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2012
Session ID : OS1906
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OS1906 Evaluation on Mechanical Properties of Nano-structured Low-k Insulating Layer
Ryota MAENOToshiki FUJIIMasaki OMIYA
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Abstract
Semiconductor devices are getting smaller and smaller, which lead to some problems such as cross-talk and signal delay. Therefore, the low-dielectric insulating layer is necessary for semiconductor devices. To overcome this problem, we propose a nano-structured insulating layer. Nano-sized structure is orderly aligned, which are made by dynamic oblique deposition (DOD). The size and structure of structure can be controlled in DOD method and, thus, the amounts of air space in insulating layer are able to be controlled. The objective of this study is to present the way to measure Elastic modulus about multilayer thin films, and to measure elastic modulus of nano-structured insulating layer. Multilayer structure is modeled as serial springs, so we obtain the elastic modulus of nano-structured insulating layer from nano-indentation results. The results show that elastic modulus of nano-structured insulating layer is mainly influenced by the volume density of nano-structures.
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© 2012 The Japan Society of Mechanical Engineers
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