抄録
Soldering is essential technique for assembly of parts of cars, devices, IC's, and so on. The main component of solder is tin. We electrochemically analyzed the oxidation rate of tin because that the oxide thickness affects the strength of oxide film on tin surface. The methods we used are measuring polarization curve and exposed test in several pH solutions. The polarization results show that the oxidation rate in acidic or alkali solution is 10 times higher than in neutral solution. The oxidation mechanisms of tin are also different. The oxidation rate is controlled by oxide supply in acidic solution. The rate is controlled by metal dissolve reaction in neutral solution.
