屈曲した三次元き裂の応力拡大係数

抄録

In recent years, with the miniaturization and thinning of electronic devices, it has become necessary to evaluate the state near the crack front of 3D crack problem. In particular, creased 3D cracks often occur when the corners of the bonding interface peel or when cracks propagate along grain boundaries. The cracks must be analyzed by a high accuracy numerical method because there is no exact solution. In this study, a creased 3D crack problem was analyzed by body force method (BFM). However, it is difficult to analyze by ordinary BFM using the stress technique. Therefore, the crack face is discretized by rectangular boundary elements of linearly changing weight function of the body force doublet. And the resultant force over an each element is used to satisfy the stress boundary condition. The analyzed SIF of rectangular crack under remote tension using resultant force technique agree well with the results of Isida et. al. and Wang et. al.