生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: 232
会議情報
232 円盤状小径回転ツールのポリシング特性(OS5 電子部品・光学部品の超精密加工)
劉 長嶺大森 整河西 敏雄林 偉民潘 燕
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会議録・要旨集 フリー

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In the finishing of high precision aspherical surfaces, computer-controlled small tool polishing is usually employed to maintain or improve the obtained form accuracy. It is necessary to grasp the characteristics of the small tool, such as the relationships between polishing conditions and material removal distribution or material removal rate. Some investigations about a disc-shaped small rotary polisher had been made in the previous research. In this paper, we made further efforts to reveal behaviors of the small rotary polisher when polishing at edge areas and inclined surfaces. It was found that the polisher can maintain balance when overhang is less than 1/3 of its diameter, and different scan direction gives varied influence to the material removal distribution when polishing inclined surface.

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© 2001 一般社団法人 日本機械学会
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