抄録
By effetely using ductile-mode mechanism, the material is removed within a plastic region so that no crack remains on the corresponding surface after machining. In principle, however, there are still plastic strains developed, which form a damaged layer at subsurface. This fact makes it very difficult to completely remove the damaged subsurface layer by fixed abrasives. This research has proposed a new chemo-mechanical-grinding (CMG) process by adding chemical effect into the grinding process, to achieve a perfectly damage-free surface.
