生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
会議情報
407 シリコンウェハ MCP 用砥粒の加工特性比較
安永 暢男
著者情報
会議録・要旨集 フリー

p. 99-100

詳細
抄録
Usefulness of BaCO_3,CaCO_3,ZnO and Mica abrasive is found for super-smooth mechanochemical polishing of large size silicon wafers. Machining characteristics of these abrasives depend on material quality of the polishing plates and polishing conditions. This paper describes comparison of polishing performances of these 4 mechanochemical abrasives. These results would be very useful as the fundamental data for determining optimum polishing conditions required for machining needs like improvement of flatness, smoothness and machining efficiency.
著者関連情報
© 2002 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top