抄録
Cu direct drilling using CO2 laser is remarkable for a processing method which connects between layers of the multi-layered PWBs. In this research the index of absorption on the surface of copper foil for the outside layer circuit was obtained from the measurement data of the infrared rays thermography, and the relationship was examined between the copper foil surface absorption rate and the processing hole diameter. Moreover, the processing hole quality paid attention to the amount of the overhang.
