抄録
We draw attention to improving the laser-drilled hole quality. In the present paper, we applied a data-mining method to the FEM data of thermal stress in order to elucidate the factors which influenced the thermal stress of the copper plating on the laser-drilled hole wall. As a result, it is clear that a new factor which influences the unreliability for circuit connections is mined out, despite the presence of complex factors. Moreover, we tried express the above results visually using the face method.
