抄録
A new process to fabricate various submicron structures on the surface of hard brittle materials without utilizing photolithography method is proposed. The process combines metal deposition, nano plastic forming (NPF), and etching technologies as one complete sequence. A silicon wafer is used as substrate, and it is coated with thin metal layer by deposition technique, which layer works as a mask of etching process. Then submicron structure is drawn on the metal layer by using nano plastic forming instead of UV or electron beam patterning. The patterned specimen was etched first by the sputter etching, then by KOH (wet etching) to fabricate submicron pattern on the silicon wafer. This process was studied experimentally, and feasibility of the process is confirmed.
