生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: C13
会議情報
C13 サファイアウエハのスパイラル超音波援用研削における砥石摩耗特性 : ビトリファイドダイヤモンド砥石の作用面トポグラフィー(OS7 研削・砥粒加工(1))
藤本 正和呉 勇波野村 光由三浦 拓也梁 志強
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会議録・要旨集 フリー

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This paper deals with the wear characteristics of grinding wheel on spiral ultrasonic assisted grinding of sapphire wafer. The spiral ultrasonic assisted grinding (SUAG) using vitrified diamond grinding wheel have been carried out and sequential changes of the wheel working surface topography have been observed during grinding process using a scanning electron microscope with four electron probes (3D-SEM). The obtain results show that the wheel wear in SUAG process is reduced compared with conventional grinding (CG) process. Especially, these results are closely related that a maintaining of good wheel surface in SUAG is demonstrated based on quantitative evaluation using number of grain cutting edges.
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