The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2014.10
Session ID : C27
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C27 The high efficient polishing technology for sapphire wafer using electrical abrasives control technique : 2nd report
Hiroshi IKEDATakayuki KUSUMIRyuta NAKAMURAYoichi AkagamiSyogo CHIBAMisato IGA
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Abstract
It takes a lot of time to process the single crystal sapphire substrates for LED, because it is hard process material and its diameter trend becomes larger for productivity improvement. Therefore we have attempted to develop the novel processing technologies that enhance the process ability of sapphire substrates. This paper describes the results pertaining to the evaluation of sapphire substrates polishing. It was confirmed the applied AC electric field leads to enhance removal rate, while the surface roughness was comparable.
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© 2014 The Japan Society of Mechanical Engineers
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