レーザによる穴あけと穴内面への成膜を同時に行う加工法に関する研究

抄録

We propose processing method of laser drilling and film deposition on hole inner surface simultaneously. The method is laser irradiation from above to the sample of drilled material on film material. In this study, experiments were carried out for the purpose of elucidation of this deposition process. Irradiating the strong light to the sample side while laser irradiation from above to the sample, the processing state was captured by high-speed camera. Also, taking the copper plates from sample later laser irradiation and observing them, the amount of scattered copper was estimated.