MNM-3A-7 電圧印加に伴うナノスケール加工現象のTEM内その場観察(セッション 3A 単結晶・多結晶シリコンの疲労寿命評価とメカニズムの解明)
詳細
Nanomachining is one of the key technologies for the practical use of MEMS or other engineering applications. To investigate the process of nanoscale SPM fabricating method, TEM in-situ observation system was constructed. In the system, the probe made of tungsten can be operated with nanometer scale accuracy by using piezoelectric element. When the probe was approached to HOPG specimen, the migration of HOPG with applied voltage was observed. When the probe contacted, the HOPG was fractured and dislocations were observed in the HOPG.
