抄録
Lift-off process and etching process have been applied for patterning in MEMS. Especially for thick film pattern, lift-off process is superior in terms of profile accuracy and material selectivity. Although high-polymer material is widely used as lift-off resist, they are curing and become deformed in a hot environment in thick film deposition. In this paper, we propose a new process where electroformed metal is used as lift-off resist. We attempted to fabricate thick film pattern of metallic glass, which is difficult to etching, by this process. As results, we achieved to fabricate thick film pattern and showed potential for applicability of thick film patterning to the proposed process.
